Electronic component mounting apparatus and method

ABSTRACT

An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.

TECHNICAL FIELD

The present invention relates to a structure of an electronic componentmounting apparatus for mounting an electronic component on a substrateor the like, and also to a method therefor.

BACKGROUND ART

There are many techniques used for mounting an electronic component witha solder bump formed on an electrode on a substrate through thermalbonding. In these techniques, the electronic component is pressedagainst the substrate using a bonding tool and heated to melt the solderbump for solder bond onto an electrode of the substrate. In this thermalbonding process, continuous pressing after melting the solder bump cansquash and deform the melted solder. To avoid deforming the solder bump,the position of the thermal bonding tool is fixed before melting thesolder bump. However, even if the thermal bonding tool may be fixed,there is still deformation due to loading in a load cell for detecting apressing force. Upon release of this residual deformation, the thermalbonding tool can move downward to squash and deform the melted solderbump.

There have hence been proposed techniques of bringing a thermal bondingtool to have a reduced pressing force before solder bump melting, usingthe thermal bonding tool to press an electronic component having asolder bump against a substrate, starting to heat the electroniccomponent, and then if the pressing force becomes equal to or lower thana predetermined value, raising the thermal bonding tool based on thedetermination that the solder is melted (see Patent Documents 1 and 2,for example).

There has also been proposed a technique of, after starting to increasethe temperature of an electronic component using a thermal bonding tool,bringing a head tool into constant control of a pressing force on theelectronic component, detecting reduction in the loading measured usinga load cell to determine that the solder is melted, and switching theoperation of the head tool from the constant loading control to positioncontrol in which the height of a leading end of a suction nozzle is madepositionally constant to reliably control the dorsal height of theelectronic component even while the solder is melted (see PatentDocument 3, for example).

RELATED ART DOCUMENTS Patent Documents

-   Patent Document 1: Japanese Patent No. 3399323-   Patent Document 2: Japanese Patent No. 3399324-   Patent Document 3: Japanese Unexamined Patent Application    Publication No. 2003-31993

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

Incidentally, gold-solder fusion bond has recently and frequently beingused in which a gold bump is formed on an electrode of an electroniccomponent, while a thin solder film is provided on the surface of acopper electrode of a substrate, and the gold bump and the solder arethermally fused and bonded. In this technique, the film formed on thesurface of the substrate electrode has a small thickness of 10 to 30 μm.Applying this to the related arts disclosed in Patent Documents 1 to 3,the sink of the thermal bonding tool immediately after the loadingdecreases can be accordingly greater than the thickness of the solderfilm. This can cause the leading end of the gold bump formed on theelectrode of the electronic component to come into contact with thesurface of the copper electrode of the substrate during mounting of theelectronic component. In this case, loading on the electronic componentand/or the gold bump before raising the thermal bonding tool can damagethe electronic component, and/or the contact between the gold bump andthe copper electrode can cause the gold bump to be deformed and comeinto contact with an adjacent gold bump, resulting in poor bondingquality.

It is hence an object of the present invention to improve the quality ofbonding in an electronic component mounting apparatus for bonding anelectronic component and a substrate with thermally fusible bond metal.

Means for Solving the Problems

The present invention is directed to an electronic component mountingapparatus for mounting an electronic component on a substrate by bondingan electrode of the electronic component and an electrode of thesubstrate with thermally fusible bond metal, the apparatus including: abonding tool for thermally bonding the electronic component onto thesubstrate, the bonding tool to be driven in a direction getting close toand away from the substrate; a drive unit for driving the bonding toolin the direction getting close to and away from the substrate; aposition detection unit for detecting the position of the bonding toolin the direction getting close to and away from the substrate; and acontrol unit for changing the position of the bonding tool in thedirection getting close to and away from the substrate with the driveunit, in which the control unit includes bonding tool position holdingmeans for holding the position of the bonding tool in the directiongetting close to and away from the substrate based on the determinationthat the bond metal between the electrode of the electronic componentand the electrode of the substrate is thermally fused when the bondingtool gets close to the substrate by a predetermined distance from areference position while heating the electronic component.

In the electronic component mounting apparatus according to the presentinvention, it is also preferable that the electronic component includesa bump formed on the electrode and the substrate includes a film of thebond metal formed on the electrode, and that the control unit furtherincludes: contact detecting means for determining whether or not thebump and the film are in contact with each other based on a signal fromthe position detection unit; and reference position setting means forsetting the position of the bonding tool with respect to the substrateas the reference position when the contact detecting means determinesthat the bump and the film are in contact with each other.

In the electronic component mounting apparatus according to the presentinvention, it is also preferable that the control unit further includes:second reference position setting means for setting the position of thebonding tool with respect to the substrate as a second referenceposition after the reference position setting means sets the referenceposition and when the distance of the bonding tool from the substrate inthe direction getting close to and away from the substrate changes fromincreasing to decreasing; and second bonding tool position holding meansfor holding the position of the bonding tool in the direction gettingclose to and away from the substrate based on the determination that thebond metal between the electrode of the electronic component and theelectrode of the substrate is thermally fused when the bonding tool getsclose to the substrate by a second predetermined distance from thesecond reference position while heating the electronic component.

The present invention is also directed to an electronic componentmounting method for mounting an electronic component on a substrate bybonding an electrode of the electronic component and an electrode of thesubstrate with thermally fusible bond metal, the method including:preparing an electronic component mounting apparatus including a bondingtool for thermally bonding the electronic component onto the substrate,the bonding tool to be driven in a direction getting close to and awayfrom the substrate, a drive unit for driving the bonding tool in thedirection getting close to and away from the substrate, and a positiondetection unit for detecting the position of the bonding tool in thedirection getting close to and away from the substrate; and holding theposition of the bonding tool in the direction getting close to and awayfrom the substrate based on the determination that the bond metalbetween the electrode of the electronic component and the electrode ofthe substrate is thermally fused when the bonding tool gets close to thesubstrate by a predetermined distance from a reference position whileheating the electronic component.

In the electronic component mounting method according to the presentinvention, it is also preferable that the electronic component includesa bump formed on the electrode and the substrate includes a film of thebond metal formed on the electrode, and the method further includes:determining whether or not the bump and the film are in contact witheach other based on a signal from the position detection unit; andsetting the position of the bonding tool with respect to the substrateas the reference position when it is determined in the step ofdetermining that the bump and the film are in contact with each other.

In the electronic component mounting method according to the presentinvention, it is also preferable that the method further includes:setting the position of the bonding tool with respect to the substrateas a second reference position after the reference position is set inthe step of setting and when the distance of the bonding tool from thesubstrate in the direction getting close to and away from the substratechanges from increasing to decreasing; and holding the position of thebonding tool in the direction getting close to and away from thesubstrate based on the determination that the bond metal between theelectrode of the electronic component and the electrode of the substrateis thermally fused when the bonding tool gets close to the substrate bya second predetermined distance from the second reference position whileheating the electronic component.

Advantage

The present invention offers the advantage of improving the quality ofbonding in an electronic component mounting apparatus for bonding anelectronic component and a substrate with thermally fusible bond metal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a system diagram showing the configuration of an electroniccomponent mounting apparatus according to an exemplary embodiment of thepresent invention.

FIG. 2 is an illustrative view showing an electronic component and asubstrate set in the electronic component mounting apparatus accordingto the exemplary embodiment of the present invention.

FIG. 3 is a schematic view showing a linear scale used in the electroniccomponent mounting apparatus according to the exemplary embodiment ofthe present invention.

FIG. 4 is a flowchart showing an operation of the electronic componentmounting apparatus according to the exemplary embodiment of the presentinvention.

FIG. 5 is an illustrative view showing the change in the position of abonding tool, the pressing force, and the temperature of a solder layerduring an operation of the electronic component mounting apparatusaccording to the exemplary embodiment of the present invention.

FIG. 6 is an illustrative view showing a process of gold-solder fusionbond between a gold bump and a solder film performed by the electroniccomponent mounting apparatus according to the exemplary embodiment ofthe present invention.

MODES FOR CARRYING OUT THE INVENTION

An exemplary embodiment of the present invention will hereinafter bedescribed with reference to the accompanying drawings. As shown in FIG.1, an electronic component mounting apparatus 100 according to thepresent invention is configured to include a base 10, a frame 11extending upward from the base 10, an upper flange 12 extending from anupper portion of the frame 11, a guide 14 provided vertically on a sidesurface of the frame 11, a slider 16 attached vertically slidably to theguide 14, a rise-and-fall block 15 fixed to the slider 16 to be movablevertically with the slider 16, a nut 17 fixed to the rise-and-fall block15, a feed screw 18 to be screwed into the nut 17, a motor 13 fixed tothe upper flange 12 and configured to turn the feed screw 18, a voicecoil motor 20 attached to a lower portion of the rise-and-fall block 15,a rod 26 to be moved vertically by the voice coil motor 20, a ceramicheater 27 attached at a leading end of the rod 26, a bonding tool 28attached at the lower end of the ceramic heater 27 and configured tosuck an electronic component 31, a bonding stage 41 for sucking andfixing a substrate 42 thereon, and a control unit 50. The motor 13 andthe voice coil motor 20 constitute a drive unit for vertically drivingthe bonding tool 28.

The voice coil motor 20 is configured to include a casing 21, apermanent magnet stator 22 fixed along the inner periphery of the casing21, and a movable coil 23 arranged inside the stator 22. The rod 26 isattached to the casing 21 via a plate spring 25. Also, an L-shapedlinear scale 61 with a finely-scaled vertical portion is fixed to therod 26. A linear scale head 62 for reading a pattern on the linear scale61 is attached to the outer surface of the casing 21 in a manner facingtoward the linear scale 61. The linear scale 61 and the linear scalehead 62 constitute a position detection unit for detecting the positionof the bonding tool 28 in the height direction. The coil 23 of the voicecoil motor 20 is supplied with driving power from a power source 19. Thebonding stage 41 incorporates a stage heater 48 for heating thesubstrate 42 sucked and fixed on the bonding stage 41.

The control unit 50 is a computer incorporating a CPU 51 for signalprocessing and a memory 52. The memory 52 stores a bonding program 53for bonding control, control data 58, a reference position settingprogram 54, a bonding tool position holding program 55, a secondreference position setting program 56, a second bonding tool positionholding program 57, and a contact detecting program 59.

The motor 13 is connected to the control unit 50 and arranged such thatthe direction and angle of rotation are controlled with a command fromthe control unit 50. The power source 19 is also connected to thecontrol unit 50 and arranged such that the current and voltage output tothe coil 23 are altered with a command from the control unit 50. Theceramic heater 27 and the stage heater 48 are also connected to thecontrol unit 50 and arranged such that the heating state is controlledwith a command from the control unit 50.

As shown in FIG. 2, the electronic component 31, which is sucked upsidedown at the leading end of the bonding tool 28, has multiple electrodes32 provided on the surface thereof, and each gold bump 33 is formed oneach of the electrodes 32. Each gold bump 33 has a disk-shaped baseportion 34 on the side of the electrode 32 and a conical convex portion35 protruding from the base portion 34. The substrate 42, which issucked and fixed on the bonding stage 41, has copper electrodes 43formed on the surface thereof, and a solder film 44 is formed on each ofthe copper electrodes 43. The solder film 44 has a very small thicknessof about 10 to 30 μm. The electrode 32, the gold bump 33, and the copperelectrode 43 of the substrate are arranged in a manner facing towardeach other.

As shown in FIG. 3, the linear scale 61 includes a linear scale mainbody 61 a on which a pattern 61 b with a very fine pitch L is provided.The linear scale head 62 incorporates a light source for deliveringlight to the pattern 61 b on the linear scale 61, a grating throughwhich the light from the light source passes, a light-receiving devicefor detecting light reflected from the pattern 61 b on the linear scale61, and a signal processing unit for processing a signal input from thelight-receiving device. Light emitted from the light source passesthrough the grating and undergoes reflection at the pattern 61 b on thelinear scale 61 to generate an interference fringe on, for example, aphotodiode serving as the light-receiving device. When the linear scale61 moves relatively to the linear scale head 62 in the longitudinaldirection of the pattern 61 b, the interference fringe also moves andthereby the light-receiving device outputs a sine-wave signal with aperiod equal to or half the pitch L of the pattern 61 b. The sine-wavesignal is a biphasic sine wave with 90-degree mutually shifted phases.The linear scale head 62 instructs the signal processing unit to outputan amount of relative movement of the linear scale 61 to the linearscale head 62 based on the output difference of the biphasic sine wave.The detection accuracy of the amount of movement is about 1 nm if thepitch L of the pattern 61 b is several micrometers, for example.

With reference to FIGS. 4 to 6, a bonding operation will be described ofbonding the electronic component 31 to the substrate 42 shown in FIG. 2using the thus configured electronic component mounting apparatus 100.It is here noted that the electronic component includes a semiconductorchip, a transistor, and a diode. After the alignment of the electrodes32 of the electronic component 31 with respect to the copper electrodes43 of the substrate 42 is completed as shown in FIG. 2, the control unit50 starts a lowering operation of lowering the bonding tool from aninitial height H₀ as shown in step S101 of FIG. 4 and the time intervalfrom t₁ to t₂ of FIG. 5. This lowering operation is performed byrotating the motor 13 shown in FIG. 1 and thereby turning the feed screw18 so that the rise-and-fall block 15 with the nut 17 into which thefeed screw 18 is being screwed fixed therein moves downward. The controlunit 50 detects a lowered position based on the angle of rotation of themotor 13 and, as shown in step S102 of FIG. 4, determines whether or notthe bonding tool is lowered to a predetermined height H₁ shown in FIG.5. When the bonding tool is lowered to the height H₁, the gold bump 33comes very close to the solder film 44 and the copper electrode 43 asshown in FIG. 6( a), yet there is still a gap between the convex portion35 of the gold bump 33 and the solder film 44. In this loweringoperation, since the voice coil motor 20, the rod 26, and the bondingtool 28 are lowered as one, there occurs no height difference betweenthe linear scale 61 fixed to the rod 26 and the casing 21 of the voicecoil motor 20 and the detection signal from the linear scale head 62remains unchanged from an initial output.

In addition, the control unit 50, if determines that the bonding tool islowered to the predetermined height H₁, stops the motor 13 and thereforethe lowering operation and then, as shown in step S103 of FIG. 4, startsa search operation of detecting a position where the leading end of thegold bump 33 shown in FIG. 2 comes into contact with the solder film 44on the copper electrode 43 of the substrate 42. In this searchoperation, the bonding tool 28 is lowered slowly until the leading endof the convex portion 35 of the gold bump 33 comes into contact with thesurface of the solder film 44 as shown in the time interval from t₂ tot₃ of FIG. 5. This operation is performed by, for example, changing thecurrent through the coil 23 of the voice coil motor 20 as follows.

When the control unit 50 outputs a command for position lowering duringthe search operation, the power source 19 applies a current to the coil23 of the voice coil motor 20 based on the command value for positionlowering. Accordingly, the coil 23 moves downward, so that the leadingend 24 of the coil comes into contact with the upper end of the rod 26.Since the rod 26 is attached to the casing 21 via the plate spring 25,when an increased current flows through the coil 23 to result in thatthe leading end 24 of the coil 23 presses down the rod 26 and the platespring 25 undergoes a deflection according to the pressing force, therod 26 moves downward and thereby the leading end of the bonding tool 28is lowered slowly. When the rod 26 moves downward, there occurs arelative height difference between the linear scale 61 fixed to the rod26 and the casing 21 of the voice coil motor 20, which causes the linearscale head 62 to detect the amount of movement of the linear scale 61.The control unit 50 obtains the lowered position of the bonding tool 28based on the change in the signal detected by the linear scale head 62and feeds back the command value for position lowering to adjust thecurrent output from the power source. The control unit 50 can thusperform a search operation of gradually increasing the current throughthe coil 23 to lower the leading end of the bonding tool 28 slowly.

During the search operation, the control unit 50 uses contact detectingmeans to monitor if the leading end of the convex portion 35 of the goldbump 33 is in contact with the surface of the solder film 44 as shown instep S104 of FIG. 4. When the leading end of the convex portion 35 ofthe gold bump 33 comes into contact with the solder film 44, the coil 23stops moving downward and there starts to appear a difference betweenthe lowered position detected by the linear scale head 62 and thecommand value for position lowering during the search operation. Whenthe difference between the command value for position lowering and thelowered position detected by the linear scale head 62 exceeds apredetermined threshold value, the control unit 50 determines that theleading end of the convex portion 35 of the gold bump 33 comes intocontact with the solder film 44 (contact detecting step). It is notedthat since the vertical position of the linear scale 61 is adjusted suchthat the longitudinal center of the pattern 61 b comes directly in frontof the linear scale head 62 when the leading end of the convex portion35 of the gold bump 33 comes into contact with the solder film 44, thelinear scale head 62 can measure the amount of vertical movementcentering on the point at which the leading end of the convex portion 35of the gold bump 33 comes into contact with the solder film 44.

The control unit 50, if determines that the leading end of the convexportion 35 of the gold bump 33 comes into contact with the solder film44, determines that the bonding tool 28 reaches a reference height H₂and sets the height H₂ detected by the linear scale head 62 as areference height (reference position) of the bonding tool 28 as shown instep S105 of FIG. 4 and the time t₃ of FIG. 5 (reference positionsetting step). FIG. 6( b) shows a state where the leading end of theconvex portion 35 of the gold bump 33 comes into contact with the solderfilm 44.

After setting the reference height, the control unit 50 performs aconstant loading operation in which the bonding tool 28 presses down thesubstrate 42 at a constant pressing force as shown in step S106 of FIG.4. In this operation, an approximately constant current can flow throughthe coil 23 of the voice coil motor 20, for example, so that the leadingend 24 of the coil 23 presses down the rod 26 at a constant force.Alternatively, a sensor for detecting a pressing force at which thebonding tool 28 presses down the substrate 42 can be provided and thecurrent through the coil 23 can be controlled to change such that thepressing force detected by the sensor represents a constant value, asmentioned above. As shown in step S107 of FIG. 4, the control unit 50takes difference between the amount of vertical movement detected by thelinear scale head 62 and the reference height H₂ to calculate thedistance by which the bonding tool 28 comes close to the substrate 42from the height H₂ (reference height) when the leading end of the convexportion 35 of the gold bump 33 comes into contact with the solder film44, that is, the distance of downward movement from the reference heightH₂ as a sink D. The control unit 50 then starts to monitor if the sink Dexceeds a predetermined threshold value as shown in step S108 of FIG. 4.

Since the leading end of the convex portion 35 of the gold bump 33 isnot in contact with the solder film 44 in the time interval from t₁ tot₃ of FIG. 5, the solder film 44 is heated by the stage heater 48 shownin FIG. 1 to have the same temperature T₀ as the substrate 42. Incontrast, the electronic component 31 is heated to a high temperature bythe ceramic heater 27 disposed on the bonding tool 28. Accordingly, whenthe leading end of the convex portion 35 of the gold bump 33 comes intocontact with the solder film 44 at the time t₃ of FIG. 5, heat starts totransfer from the leading end of the convex portion 35 of the gold bump33 to the solder film 44. The temperature of the solder film 44 thenstarts to rise at the time t₄ of FIG. 5. As the temperature of thesolder film 44 rises in the time interval from t₄ to t₅ of FIG. 5, thetemperature of the copper electrode 43 also rises accordingly to resultin that the copper electrode 43 and the solder film 44 undergo thermalexpansion. Since the pressing force is constant during this timeinterval, the bonding tool 28 is raised gradually from the referenceheight H₂ when the leading end of the gold bump 33 comes into contactwith the solder film 44, and finally reaches a height H₃ at the time t₅.At this time, the bonding tool 28 is positioned at the height H₃, whichis greater than the reference height H₂, so that the amount of downwardmovement D₁(=H₂−H₃) from the reference height H₂ is negative as shown inFIG. 5, that is, the sink D does not exceed the predetermined thresholdvalue.

At the time t₅ of FIG. 5, when the solder film 44 is heated to atemperature T₁ at which the solder is fused, the solder film 44 startsto be fused. In this case, the bonding tool 28 is controlled to have aconstant pressing force, which causes the convex portion 35 of the goldbump 33 to sink into the fused solder film 44 as shown in FIG. 6( c).That is, the height of the bonding tool 28 changes from increasing todecreasing at the time t₅ and height H₃ shown in FIG. 5. The loweredconvex portion 35 is then surrounded by the fused solder 45. As theleading end of the convex portion 35 of the gold bump 33 thus sinks intothe solder film 44, the height of the bonding tool 28 is made lower thanthe reference height H₂, that is, the sink D, the amount of downwardmovement from the reference height H₂, becomes positive. When thebonding tool is lowered to a height H₄ and the sink D(=H₂−H₄) becomes apredetermined value at the time t₆ of FIG. 5, the solder film 44 existsat a thickness of several micrometers between the leading end of theconvex portion 35 of the gold bump 33 and the copper electrode 43 of thesubstrate 42 as shown in FIG. 6( c). When the sink D exceeds apredetermined threshold value, the control unit 50 stops the constantloading control based on the determination that the solder film 44 isthermally fused and then starts a bonding tool position holdingoperation of holding the height H₄ of the bonding tool 28 at the time t₆as shown in step S109 of FIG. 4.

In this operation, for example, the current through the coil 23 of thevoice coil motor 20 can be changed by the difference between the amountof vertical movement detected by the linear scale head 62, so that thebonding tool 28 is at the height H₄ and the reference height H₂ becomesequal to or smaller than a predetermined threshold value. Since thesolder film 44 has a thickness of 10 to 30 μm, measuring and controllingthe vertical position of the bonding tool 28 using the linear scale head62 in the order of about 1 nm allows the solder film 44 to exist stablyat a thickness of several micrometers between the leading end of theconvex portion 35 of the gold bump 33 and the copper electrode 43 of thesubstrate 42 as shown in FIG. 6( c).

The control unit 50 starts a cooling operation, as shown in step S110 ofFIG. 4, at the start of the bonding tool position holding operation. Inthis cooling operation, the ceramic heater 27 heating the bonding tool28 is turned off and cooled with supplied cooling air, for example, tocool the bonding tool 28 and the electronic component 31 sucked at theleading end thereof together with the ceramic heater 27. This causes thesolder 45 to be cooled while the solder film 44 still exists stably at athickness of several micrometers between the leading end of the convexportion 35 of the gold bump 33 and the copper electrode 43 of thesubstrate 42 as shown in FIG. 6( c). At the time t₇ of FIG. 5, when thesolder film 44 is cooled to a temperature T₃ at which the solder issolidified, the solder 45 starts to be solidified to be bond metal 46with the solder film 44 existing at a thickness of several micrometersbetween the leading end of the convex portion 35 of the gold bump 33 andthe copper electrode of the substrate 42 as shown in FIG. 6( d). After apredetermined period of time has elapsed, the control unit 50 determinesthat the cooling operation is completed as shown in step S111 of FIG. 4and releases the electronic component 31 sucked on the bonding tool 28,and then raises the bonding tool 28 to the initial height H₀ by rotatingthe motor 13 and thereby turning the feed screw 18 as shown in step S112of FIG. 4 to complete the bonding of the electronic component 31.

As described heretofore, since the electronic component mountingapparatus 100 of this exemplary embodiment transits from the constantloading control to the bonding tool position holding control bydetermining that the solder film 44 is fused based on the sink D of thebonding tool 28, the bonding tool 28 can be held at a height after asmall sink D due to solder fusion. This allows the solder to besolidified and the electronic component 31 to be mounted with theleading end of the convex portion 35 of the gold bump 33 existing withinthe thin solder film 44 without being in contact with the copperelectrode 43 of the substrate 42. It is thus possible to prevent theconvex portion 35 of the gold bump 33 from coming into contact with thecopper electrode 43, whereby it is also possible to prevent the goldbump 33 from being deformed to come into fault contact with an adjacentgold bump 33 and the electronic component from being damaged throughcontact loading, resulting in an improvement in the bonding quality.

Although the exemplary embodiment above describes the case of settingthe height when the leading end of the convex portion 35 of the goldbump 33 comes into contact with the solder film 44 as a reference heightH₂ of the bonding tool 28, the height H₃ at the time t₅ of FIG. 5 thatthe height of the bonding tool 28 changes from increasing to decreasingafter the leading end of the convex portion 35 of the gold bump 33 comesinto contact with the solder film 44 can be set as a second referenceheight (second reference position setting step). In this case, thecontrol is switched from constant loading to bonding tool positionholding when the sink becomes D₂=H₃−H₄ as shown in FIG. 5, as is thecase in the above-described exemplary embodiment (second bonding toolposition holding operation). This offers the same advantage as theabove-described exemplary embodiment.

The present invention is not limited to the above-described exemplaryembodiment, and various variations and modifications can be made withoutdeparting from the technical scope and nature of the invention definedin the appended claims.

DESCRIPTION OF REFERENCE NUMERALS

-   10 Base-   11 Frame-   12 Upper flange-   13 Motor-   14 Guide-   15 Rise-and-fall block-   16 Slider-   17 Nut-   18 Feed screw-   19 Power source-   20 Voice coil motor-   21 Casing-   22 Stator-   23 Coil-   24 Leading end-   25 Plate spring-   26 Rod-   27 Ceramic heater-   28 Bonding tool-   31 Electronic component-   32 Electrode-   33 Gold bump-   34 Base portion-   35 Convex portion-   41 Bonding stage-   42 Substrate-   43 Copper electrode-   44 Solder film-   45 Solder-   46 Bond metal-   48 Stage heater-   50 Control unit-   51 CPU-   52 Memory-   53 Bonding program-   54 Reference position setting program-   55 Bonding tool position holding program-   56 Second reference position setting program-   57 Second bonding tool position holding program-   58 Control data-   59 Contact detecting program-   61 Linear scale-   61 a Linear scale main body-   61 b Pattern-   62 Linear scale head-   100 Electronic component mounting apparatus

1.-6. (canceled)
 7. An apparatus for mounting an electronic component ona substrate, the apparatus comprising: a rise-and-fall block; a firstdrive unit driving the rise-and-fall block along a path toward and fromthe substrate in a gross movement; a bonding tool for thermally bondinga bump on an electrode of the electronic component and the substratewith a thermally fused bond metal; a second drive unit driving thebonding tool along the path toward and from the substrate in a finemovement, the second drive unit incorporated in the rise-and-fall blockand comprising a voice coil motor; a position detection unit fordetecting a position of the bonding tool on the path, the positiondetection unit issuing a detection signal when the bump and a film ofthe bond metal are in contact with each other; and a control unit forcontrolling the bonding tool on the path with the first drive unit andthe second drive unit, the control unit controlling the positiondetection unit for implementing a contact detecting step, a firstreference position setting step, and a bonding tool position holdingstep, the control unit comprising: the contact detecting step of movingthe bonding tool toward the substrate with the first drive unit in thegross movement and then moving the bonding tool further toward thesubstrate with the second drive unit in the fine movement and fordetermining whether or not the bump and the film are in contact witheach other based on the detection signal; the first reference positionsetting step of setting the position of the bonding tool with respect tothe substrate as a first reference position when the position detectingunit determines that the bump and the film are in contact with eachother; and the bonding tool position holding step of bringing thebonding tool close to the substrate from the first reference positionwhile heating the electronic component by controlling the second driveunit to provide a constant pressing force with which the bonding toolpresses down the substrate and holding the position of the bonding toolin the direction getting close to and away from the substrate with thesecond drive unit based on the determination that bond metal between anelectrode of the electronic component and an electrode of the substrateis thermally fused when the electronic component gets close to thesubstrate from the first reference position by a predetermined distancesmaller than the thickness of the film of the bond metal.
 8. Theelectronic component mounting apparatus according to claim 7, whereinthe control unit is further so configured as to be able to implement asecond reference position setting step, and a second bonding toolposition holding step, the control unit comprising: the second referenceposition setting step of setting the position of the bonding tool withrespect to the substrate as a second reference position after completingthe first reference position setting step of setting the first referenceposition and when the distance of the bonding tool from the substrate inthe direction getting close to and away from the substrate changes fromincreasing to decreasing; and the second bonding tool position holdingstep of bringing the bonding tool close to the substrate from the secondreference position while heating the electronic component by controllingthe second drive unit to provide a constant pressing force with whichthe bonding tool presses down the substrate and holding the position ofthe bonding tool in the direction getting close to and away from thesubstrate with the second drive unit based on the determination that thebond metal between the electrode of the electronic component and theelectrode of the substrate is thermally fused when the electroniccomponent gets close to the substrate from the second reference positionby a second predetermined distance that adds the predetermined distanceto the difference between the second reference position and the firstreference position.
 9. A method of mounting an electronic component on asubstrate using a mounting apparatus, the method comprising: preparingan apparatus comprising: a rise-and-fall block; a first drive unitdriving the rise-and-fall block along a path toward and from thesubstrate in a gross movement; a bonding tool for thermally bonding abump on an electrode of the electronic component and the substrate witha thermally fused bond metal; a second drive unit driving the bondingtool along the path toward and from the substrate in a fine movement,the second drive unit incorporated in the rise-and-fall block andcomprising a voice coil motor; a position detection unit for detecting aposition of the bonding tool on the path, the position detection unitissuing a detection signal when the bump and a film of the bond metalare in contact with each other; and a control unit for controlling thebonding tool on the path with the first drive unit and the second driveunit; moving the bonding tool toward the substrate with the first driveunit and then moving the bonding tool further toward the substrate withthe second drive unit while determining with the position detection unitwhether or not the bump and the film are in contact with each otherbased on the detection signal; setting the position of the bonding toolwith respect to the substrate as a first reference position when it isdetermined in the step of determining that the bump and the film are incontact with each other; and bringing the bonding tool close to thesubstrate from the first reference position while heating the electroniccomponent by controlling the second drive unit so as to provide aconstant pressing force with which the bonding tool presses down thesubstrate and holding the position of the bonding tool in the directiongetting close to and away from the substrate with the second drive unitbased on the determination that bond metal between an electrode of theelectronic component and an electrode of the substrate is thermallyfused when the electronic component gets close to the substrate from thefirst reference position by a predetermined distance smaller than thethickness of a film of the bond metal.
 10. The electronic componentmounting method according to claim 9, further comprising: setting theposition of the bonding tool with respect to the substrate as a secondreference position after the first reference position is set in the stepof setting and when the distance of the bonding tool from the substratein the direction getting close to and away from the substrate changesfrom increasing to decreasing; and bringing the bonding tool close tothe substrate from the second reference position while heating theelectronic component by controlling the second drive unit so as toprovide a constant pressing force with which the bonding tool pressesdown the substrate and holding the position of the bonding tool in thedirection getting close to and away from the substrate with the seconddrive unit based on the determination that the bond metal between theelectrode of the electronic component and the electrode of the substrateis thermally fused when the electronic component gets close to thesubstrate from the second reference position by a second predetermineddistance that adds the predetermined distance to the difference betweenthe second reference position and the first reference position.